Other Deposition Services
Plasma Enhanced Chemical Vapor Deposition
We typically employ the PECVD system to coat 4” diameter silicon wafers with silicon dioxide, silicon nitride, and silicon oxynitride.
Please inquire about CVD of other materials.
We typically use the electroplating bench to deposit copper onto 4” diameter silicon wafers.
Please inquire about electroplating of other materials.
Osmium Plasma Coating
Coats non-conductive samples prior to scanning electron microscopy imaging.
Amorphous osmium coating prevents charge build-up and prevents damage to delicate samples from the electron beam.
Looking for custom substrates or coatings?
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