Our copper (Cu) material is 99.9999% pure and is deposited onto borosilicate glass microscope slides (BOROFLOAT® 33) using electron beam evaporation. We use a thin 2-7 nm layer of titanium (99.99%) as an adhesion promoter for all our copper coatings. All substrates are pre-cleaned using an ion source for quality assurance.
At Angstrom Engineering we take pride in offering high quality Substrata products and services at affordable prices.
Questions? Please email us at firstname.lastname@example.org or call our toll free line at 1 519.894.4441.