Gold Coated Ø8 in Thermal Oxide on Silicon Wafer | 1000 Å Au | 1/pkg
$1,270.00 USD
- Substrate: Ø8 in Silicon Wafer, Prime, P/Boron, <100>, 1-100 Ω-cm, 675-775 µm thick, DSP, Semi-Std Notch, 3000 Å ± 5% Wet Thermal Oxide (Both Sides)
- Adhesion Layer: Chromium (50 Å)
- Deposition Material: Gold (99.999 %)
- Gold Thickness: 1000 Å
- Pack Size: 1/pkg
- Coating Area: Single Side (polished)
This silicon wafer undergoes a thermal oxidation process in a high temperature furnace to grow a precise protective and insulating layer of silicon dioxide (SiO2) prior to metallization. Our gold (Au) material is 99.999 % pure and is deposited onto the surface of this thermal oxide on silicon wafer. We use a thin 5 nm layer of chromium (99.99 %) as an adhesion promoter. Substrates are pre-cleaned using an ion source for quality assurance.
At Angstrom Engineering we take pride in offering high quality Substrata products and services at affordable prices.
Questions? Please email us at [email protected] or call our toll free line at 1 519.894.4441.