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Silver Coated Ø3 in Silicon Wafers | 5000 Å Ag | 5/pkg

$950.00 USD

  • Substrate: Prime Grade Ø3 in Silicon Wafers (Ø76.2 mm x 0.381 mm thick, P-Type <100>, SSP)
  • Adhesion Layer: Titanium (75 Å)
  • Deposition Material: Silver (99.99 %)
  • Silver Thickness: 5000 Å
  • Pack Size: 5/pkg
  • Coating Area: Single Side (polished)

Our silver (Ag) material is 99.99 % pure and is deposited onto p-type <100> silicon (Prime grade) using electron beam evaporation. We use a thin 2-7 nm layer of titanium (99.99 %) as an adhesion promoter for all our silver coatings. All substrates are pre-cleaned using an ion source for quality assurance.

At Angstrom Engineering we take pride in offering high quality Substrata products and services at affordable prices.

Questions? Please email us at or call our toll free line at 1 519.894.4441.