Gold Coated Ø3 in Silicon Wafers | 5000 Å Au | 5/pkg
$1,615.00 USD
- Substrate: Prime Grade Ø3 in Silicon Wafers (Ø76.2 mm dia. x 0.381 mm thick, P-Type <100>, SSP)
- Adhesion Layer: Chromium (75 Å)
- Deposition Material: Gold (99.999 %)
- Gold Thickness: 5000 Å
- Pack Size: 5/pkg
- Coating Area: Single Side (polished)
Our gold (Au) material is 99.999 % pure and is deposited onto p-type <100> silicon (Prime grade) using electron beam evaporation. We use a thin 2-7 nm layer of chromium (99.99 %) as an adhesion promoter for all our gold coatings. All substrates are pre-cleaned using an ion source for quality assurance.
At Angstrom Engineering we take pride in offering high quality Substrata products and services at affordable prices.
Questions? Please email us at [email protected] or call our toll free line at 1 519.894.4441.