Gold Coated Ø4 in Thermal Oxide on Silicon Wafers | 500 Å Au | 3/pkg
$1,020.00 USD
- Substrate: Ø4 in Silicon Wafer, Prime, P/Boron, <100>, 0.001-0.005 Ω-cm, 525 ± 25 µm thick, SSP, 2 Semi-Std Flat, 2850 Å ± 5 % Wet Thermal Oxide (Both Sides)
- Adhesion Layer: Chromium (50 Å)
- Deposition Material: Gold (99.999 %)
- Gold Thickness: 500 Å
- Pack Size: 3/pkg
- Coating Area: Single Side (polished)
Our gold (Au) material is 99.999 % pure and is deposited onto p-type <100> silicon (Prime grade) using electron beam evaporation. We use a thin 2-7 nm layer of chromium (99.99 %) as an adhesion promoter for all our gold coatings. All substrates are pre-cleaned using an ion source for quality assurance.
At Angstrom Engineering we take pride in offering high quality Substrata products and services at affordable prices.
Questions? Please email us at [email protected] or call our toll free line at 1 519.894.4441.