Gold Coated Silicon Chips, 10 mm x 10 mm | 500 Å Au | 6/pkg
$195.00 USD
- Substrate: P/Boron, <100>,1-50 Ω·cm, 525 ± 20 µm thick, Prime Grade
- Adhesion Layer: Chromium (50 Å)
- Deposition Material: Gold (99.999 %)
- Gold Thickness: 500 Å
- Die Size: 10 mm x 10 mm
- Pack Size: 6/pkg
- Coating Area: Single Side (polished)
Our gold (Au) material is 99.999 % pure and is deposited onto p-type <100> silicon (Prime grade) using electron beam evaporation. We use a thin 2-7 nm layer of chromium (99.99 %) as an adhesion promoter for all our gold coatings. All substrates are pre-cleaned using an ion source for quality assurance.
At Angstrom Engineering we take pride in offering high quality Substrata products and services at affordable prices.
Questions? Please email us at coatings@angstromengineering.com or call our toll free line at 1 519.894.4441.