Gold Coated Silicon Chips, 10 mm x 10 mm | 500 Å Au | 6/pkg
$195.00 USD
- Substrate: P/Boron, <100>,1-50 Ω·cm, 525 ± 20 µm thick, Prime Grade
- Adhesion Layer: Chromium (50 Å)
- Deposition Material: Gold (99.999 %)
- Gold Thickness: 500 Å
- Die Size: 10 mm x 10 mm
- Pack Size: 6/pkg
- Coating Area: Single Side (polished)
Our gold (Au) material is 99.999 % pure and is deposited onto p-type <100> silicon (Prime grade) using electron beam evaporation. We use a thin 2-7 nm layer of chromium (99.99 %) as an adhesion promoter for all our gold coatings. All substrates are pre-cleaned using an ion source for quality assurance.
At Angstrom Engineering we take pride in offering high quality Substrata products and services at affordable prices.
Questions? Please email us at [email protected] or call our toll free line at 1 519.894.4441.