Titanium Nitride Coated Ø4 in Silicon Wafers | 500 Å TiN | 3/pkg
$1,625.00 USD
- Substrate: Prime Grade Ø4 in Silicon Wafers (Ø101.6 mm x 0.525 mm thick, P-Type <100>, SSP)
- Adhesion Layer: None (available upon request)
- Deposition Material: Titanium Nitride, TiN (99.995 %)
- Titanium Nitride Thickness: 500 Å
- Pack Size: 3/pkg
- Coating Area: Single Side (polished)
Our titanium nitride (TiN) material is 99.995 % pure and is deposited onto borosilicate glass microscope slides (BOROFLOAT® 33) using reactive Bipolar High Power Impulse Magnetron Sputtering (Bi-HiPIMS) technology. All substrates are pre-cleaned using an ion source for quality assurance.
At Angstrom Engineering we take pride in offering high quality Substrata products and services at affordable prices.
Questions? Please email us at [email protected] or call our toll free line at 1 519.894.4441.