Titanium Nitride Coated Ø4 in Silicon Wafers | 500 Å TiN | 3/pkg
$1,625.00 USD
- Substrate: Prime Grade Ø4 in Silicon Wafers (Ø101.6 mm x 0.525 mm thick, P-Type <100>, SSP)
- Adhesion Layer: None (available upon request)
- Deposition Material: Titanium Nitride, TiN (99.995 %)
- Titanium Nitride Thickness: 500 Å
- Pack Size: 3/pkg
- Coating Area: Single Side (polished)
Our titanium nitride (TiN) material is 99.995 % pure and is deposited onto borosilicate glass microscope slides (BOROFLOAT® 33) using reactive Bipolar High Power Impulse Magnetron Sputtering (Bi-HiPIMS) technology. All substrates are pre-cleaned using an ion source for quality assurance.
At Angstrom Engineering we take pride in offering high quality Substrata products and services at affordable prices.
Questions? Please email us at coatings@angstromengineering.com or call our toll free line at 1 519.894.4441.