GOLD (Au) COATED SILICON

Coating

Gold, Au

• Purity: 99.999 %
• Deposition Technique: Electron Beam Evaporation
• Deposition Rate: 1-2 Å/s
• Process Pressure ≤ 2E-6 Torr
• Adhesion Layer: Cr (99.95 %)

High-Purity Gold (Au) Coated Silicon Wafers & Chips | Prime Grade

Our gold-coated silicon substrates are engineered for high-precision thin-film research, AFM/SPM, nanotechnology, and biotechnology. Utilizing electron beam evaporation in a dedicated high-vacuum system, we deposit high-purity gold over a chromium adhesion layer to ensure stable, conductive surfaces for your most demanding experiments.

• Extensive Size Range: We offer standard wafers in Ø2”, Ø3”, and Ø4” diameters, as well as 10 x 10 mm chips diced from 4” wafers. Custom chip sizes are available upon request.

• Large-Format & Custom Wafers: We provide expanded capabilities for larger projects, including Ø6″, Ø8″, and Ø12″ silicon wafers.

• Custom Coating Services: In addition to our stock inventory, we offer bespoke gold deposition on customer-provided substrates with custom-tailored material stacks.

• Flexible Thickness Options: Our standard coating is 50 nm gold over a 5 nm chromium layer. Specialized thicknesses of 10 nm, 100 nm, and 500 nm are also available to meet specific research needs. Customized thicknesses are available upon request.

• Secure Packaging: To maintain pristine surface quality, wafers are packaged and vacuum sealed in a cleanroom environment and shipped in individual wafer carrier trays, while silicon chips are protected in Gel-Pak boxes to prevent movement and scratches during transit.

• Technical Performance: Our films are optimized for thermal stability up to 175°C. While not atomically flat, the coatings are carefully controlled to maintain high uniformity with height differences limited to the nanometer range.

For General Inquiries:

• [email protected]
• Phone: 1 519.894.4441

Gold Coated Silicon Chips

10 mm x 10 mm, P-type <100>, SSP, Prime Grade

High quality 10 mm x 10 mm x 0.525 mm thick silicon substrates coated with 500 Å (50 nm) or 1000 Å (100 nm) of gold. All coatings include a 50 Å chromium adhesion layer between the substrate surface and the gold coating. Custom gold thicknesses are available upon request.

All gold substrates are autoclavable.

Gold Coated Silicon Wafers

Ø2 in, P-type <100>, SSP, Prime Grade

High quality Ø2 in x 0.279 mm thick silicon substrates coated with pure gold (99.999 %) with thicknesses ranging from 100 Å to 5000 Å. All coatings include a 20-75 Å chromium adhesion layer between the substrate surface and the gold coating. Titanium (Ti) can also be used as an adhesion layer upon request. Custom gold thicknesses are available upon request.

All gold substrates are autoclavable.

Gold Coated Silicon Wafers

Ø3 in, P-type <100>, SSP, Prime Grade

High quality Ø3 in x 0.381 mm thick silicon substrates coated with pure gold (99.999 %) with thicknesses ranging from 100 Å to 5000 Å. All coatings include a 20-75 Å chromium adhesion layer between the substrate surface and the gold coating. Titanium (Ti) can also be used as an adhesion layer upon request. Custom gold thicknesses are available upon request.

All gold substrates are autoclavable.

Gold Coated Silicon Wafers

Ø4 in, P-type <100>, SSP, Prime Grade

High quality Ø4 in x 0.525 mm thick silicon substrates coated with pure gold (99.999 %) with thicknesses ranging from 100 Å to 5000 Å. All coatings include a 20-75 Å chromium adhesion layer between the substrate surface and the gold coating. Titanium (Ti) can also be used as an adhesion layer upon request. Custom gold thicknesses are available upon request.

All gold substrates are autoclavable.

Gold Coated Thermal Oxide Silicon Wafers

Ø4 in, P-type <100>, SSP, Prime Grade, 2850 Å SiO2

High quality Ø4 in x 0.525 mm thick silicon substrates with 2850 Å of thermal oxide on both sides and coated with pure gold (99.999 %). All silicon wafers undergo a thermal oxidation process in a high temperature furnace to grow a precise protective and insulating layer of silicon dioxide (SiO2) prior to metallization.

All metals coatings include a 50 Å chromium adhesion layer between the substrate surface and the gold coating. Titanium (Ti) can also be used as an adhesion layer upon request. Custom gold thicknesses are available upon request.

All gold substrates are autoclavable.

Gold Coated Silicon Wafers

Ø6 in, P-type <100>, SSP, Prime Grade

High quality Ø6 in x 0.675 mm thick silicon substrates coated with 1000 Å of pure gold (99.999 %). Includes a 50 Å chromium adhesion layer between the substrate surface and the gold coating. Titanium (Ti) can also be used as an adhesion layer upon request. Custom gold thicknesses are available upon request.

All gold substrates are autoclavable.

Gold Coated Thermal Oxide Silicon Wafers

Ø6 in, P-type <100>, SSP, Prime Grade, 3000 Å SiO2

High quality Ø6 in x 0.675 mm thick silicon substrates with 3000 Å of thermal oxide on both sides and coated with pure gold (99.999 %). All silicon wafers undergo a thermal oxidation process in a high temperature furnace to grow a precise protective and insulating layer of silicon dioxide (SiO2) prior to metallization.

The gold coated includes a 50 Å chromium adhesion layer between the substrate surface and the gold coating. Titanium (Ti) can also be used as an adhesion layer upon request. Custom gold thicknesses are available upon request.

All gold substrates are autoclavable.

Gold Coated Silicon Wafers

Ø8 in, P-type <100>, SSP, Prime Grade

High quality Ø8 in x 0.725 mm thick silicon substrates coated with 1000 Å of pure gold (99.999 %). Includes a 50 Å chromium adhesion layer between the substrate surface and the gold coating. Titanium (Ti) can also be used as an adhesion layer upon request. Custom gold thicknesses are available upon request.

All gold substrates are autoclavable.

Gold Coated Thermal Oxide Silicon Wafers

Ø8 in, P-type <100>, SSP, Prime Grade, 3000 Å SiO2

High quality Ø8 in x 0.725 mm thick silicon substrates with 3000 Å of thermal oxide on both sides and coated with pure gold (99.999 %). All silicon wafers undergo a thermal oxidation process in a high temperature furnace to grow a precise protective and insulating layer of silicon dioxide (SiO2) prior to metallization.

The gold coated includes a 50 Å chromium adhesion layer between the substrate surface and the gold coating. Titanium (Ti) can also be used as an adhesion layer upon request. Custom gold thicknesses are available upon request.

All gold substrates are autoclavable.